ChipMOS TECHNOLOGIES (Bermuda), LTD., together with its subsidiaries, provides testing and assembly services for liquid crystal display (LCD), and other flat-panel display driver semiconductors and advanced memory and mixed-signal products in Taiwan, Mainland China, Japan, Korea, Hong Kong, and the United States. It provides a range of back-end testing services for memory and mixed-signal semiconductors, which include engineering testing, wafer probing, laser repairing, burn-in testing, top marking, final testing, and final inspection and packing. The company's assembly services comprise wafer lapping, die saw, die attach, wire bonding, molding, marking, dejunking and trimming, electrical plating, ball mount and reflow, and forming/singulation. It also offers leadframe-based packages consisting of thin small outline packages and organic substrate-based packages, including fine-pitch ball grid array packages for memory and mixed-signal semiconductors; and gold bumping, testing, and assembly services for LCD and other flat-panel display driver semiconductors. In addition, the company provides memory module manufacturing; drop shipment services; and software engineering services, including test program development, conversion and optimization, related hardware design. Its tested and assembled products are used in personal computers; graphics applications; communications equipment; and consumer electronic products and display applications. The company was founded in 1986 and is based in Hsinchu, Taiwan.
